KOBUS Fast Atomic Sequential Technology (F.A.S.T.®) Plasma-Therm's KOBUS product line offers a dedicated solution for single wafer deposition utilizing F.A.S.T. and PECVD technologies for both R&D and production customers.

Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high-volume production in a wide range of applications.

Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production.

Plasma-Therm’s new MicroDieSingulator is the first volume-production-ready Plasma Singulator in the industry. It delivers unique benefits, especially for thin and ultra-thin wafers.

The Takachi is a robust ICP technology based on Plasma-Therm’s proven Shuttlelock® platform now available in a much smaller footprint.

Plasma-Therm’s VERSALINE DSE provides profile control and side wall smoothness while utilizing award-winning fast process control. Outstanding flexibility and process latitude are offered as well as the highest selectivities to mask material in the industry.

Plasma-Therm’s VERSALINE HDPCVD product is a new approach to achieving highly dense and conformal films at low substrate temperatures.

Plasma-Therm’s VERSALINE ICP is the product resulting from decades of technological evolution. Well-known and accepted product lines including the 790, Shuttlelock, and Versalock all played a role in the development of the VERSALINE ICP.

Plasma-Therm’s VERSALINE PECVD is the result of decades of technological innovation. VERSALINE PECVD systems can deposit many different high-quality films, delivering maximum productivity with low total cost of ownership.

Plasma-Therm’s VERSALINE RIE systems are installed in a wide range of production capacity facilities - from R&D through high-volume production. VERSALINE RIE offers low maintenance and high versatility for multiple applications.

The Vision 310 PECVD (Plasma Enhanced Chemical Vapor Deposition) is a fundamental deposition system for semiconductor fabrication and material science facilities.

Advanced Vacuum’s Vision 320 RIE (Reactive Ion Etch) provides etch capability for R&D, prototyping, and low volume production. This parallel-plate capacitance based systems is found in applications that include material, surface, semiconductor and failure analysis involving delayering.